Hermetic Packages
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TO-39 vs TO-46: A Comprehensive Guide to Choosing the Right TO Package
April 17, 2025
In the world of microelectronics, choosing the right packaging solution directly impacts the performance, reliability, and longevity of your components. One common comparison is TO-39 vs TO-46, two of the most transistor outline (TO) packages. Both are recognized for their hermetic sealing, dependable metal can construction, and JEDEC-standard configurations, yet they serve different roles in […]
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The Importance of Onshoring Hermetic Packaging in the Semiconductor Industry
August 12, 2024
The globalized world of the semiconductor industry is undergoing a transformative shift – a resurgence of onshoring. This move prioritizes domestic production, particularly for critical components like hermetic packaging. This blog delves into the technical and strategic reasons why onshoring hermetic packaging is a vital step towards a robust and secure domestic supply chain. […]
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Projection Welding Hermetic Packages & Seals
July 1, 2024
In the world of electronics and medical devices, a crucial element often goes unnoticed – the packaging. Hermetic packaging creates a barrier that shields sensitive components from the outside world, preventing moisture, dust, and contaminants from causing malfunctions. While various methods achieve hermetic seals, projection welding stands out for its efficiency and reliability. At EPI, […]
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