Power Discrete Packages
HTCC Ceramic packaging for high power densities and extreme environments
Power discrete packages are specialized components that are used to protect and preserve the integrity of power discrete devices and systems. Power discrete devices are electronic devices that are designed to handle high levels of power and are used in a variety of applications, including power conversion, power distribution, and power management.
Electronic Products (EPI) has decades of experience providing power discrete packages for applications such as industrial power, medical, oil exploration, downhole tools, propulsion systems, energy storage, and directed energy. As an example, our packages are trusted in satellite systems converting solar power to instrumentation and controls, operating under extreme environmental conditions.
Our products are designed to create a hermetic enclosure around the power discrete device or system using high temperature materials. EPI designs aluminum nitride (AlN) High Temperature Co-fired Ceramic (HTCC) hermetic packages for high power densities. AlN HTCC can be used in both high current and high voltage applications including power converters, power supplies, and power amplifiers. We can also provide compact 3D packages chip scale, flip chip, and interposer assemblies using Si, GaN, SiC or other high-power substrate materials.
High Temperature Co-fired Ceramic (HTCC) multilayer AlN circuits, fired at over 1800°C, are a fully dense hermetic structures. Our power discrete packages are designed with a low Co-efficient of Thermal Expansion (CTE), perfectly matched with Tungsten and Silicon. The tungsten metallization can be plated to match the end use and can also be brazed at high temperature to allow the attachment of leads, seal rings, or other metal components.
COMMON INDUSTRIES
- Alternative Energy
- Industrial
- Medical
- Oil / Gas (downhole, sensors/instrumentation)
- Propulsion equipment
- Satellite
POWER DISCRETE PACKAGE BENEFITS
- Wide range of operating temperatures, from cryogenic to high temperatures
- High strength over a wide range of temperatures
- Wear and corrosion resistance
- 3D hermetic structures
- Electrical isolation with thermal conduction
Image Library
SMD.5 hermetic diode package using HTCC ceramic technology
Custom Ceramic Substrate
AIN SMD.22 hermetic power package U4 layout
FAQ
WHAT IS A HERMETIC POWER DISCRETE PACKAGE?
Hermetic power discrete packages are surface mount HTCC (Hight Temperature Co-Fired Ceramic) multilayer AlN with tungsten metallization and vias . The fired metallization can be plated to the customers specification. Cu plating is sometimes incorporated to enhance the current carrying capabilities of the packages. These packages are typically used for small radiation hardened GaN or Si electronics for Aerospace and Military applications. These packages are constructed to handle high current and dissipate heat. AlN packages are much lighter weight than CuW or CuMo composites and have a well matched CTE of 4.5ppm/C.
WHAT ARE POWER DISCRETE PACKAGES?
Power discrete packages are specialized enclosures that protect and maintain the integrity of power discrete devices – electronic components designed to handle high levels of power (power conversion, distribution, management). Power discrete devices operate in demanding environments with high power. These packages create a hermetic seal, safeguarding these devices from external factors like moisture, dust, and contaminants that could cause malfunctions.
WHAT ARE THE BENEFITS OF AlN HTCC POWER DISCRETE PACKAGES?
High-temperature resistance: These packages can withstand extreme temperatures exceeding 1800°C, ideal for high-power environments.
Excellent thermal conductivity: AlN efficiently dissipates heat, ensuring optimal device performance.
Matched Coefficient of Thermal Expansion (CTE): The CTE of AlN HTCC closely aligns with Tungsten and Silicon, minimizing stress on components during temperature fluctuations.
Hermetic sealing: AlN HTCC creates a reliable enclosure, protecting devices from external elements.
WHAT IS THE OPERATING TEMPERATURE OF EPI POWER DISCRETE PACKAGES?
Power discrete package operating temperatures can be up to +250°C, but are application dependent. There are high temperature applications where the base materials can be made to withstand high temperatures for more severe applications.
WHAT IS THE MAXIMUM CURRENT RATING ON A POWER DISCRETE PACKAGE?
Maximum current will be a function of the number of vias. The standard discrete packages are less than ¼” squared and can handle approximately 20 Watts.