TO-18 Package
The TO-18 package is a type of ‘metal can’ or ‘metal header’ package designed specifically to hold semiconductor devices, like transistors, diodes and small integrated circuits. Similar to metal can packages the TO-18 is sealed tightly to protect against factors such as moisture and contaminants crucial for reliable performance in tough conditions. Renowned for its build and efficient heat dissipation abilities the TO 18 package is widely utilized in applications where durability and consistent functionality are the key.
The TO-18 package consists of a metal body housing the microchip on the die pad. It is sealed with a metal cap, usually welded or crimped ensuring an airtight seal that safeguards the components integrity. Compared to packages like the TO-39 the TO-18 is more compact yet offers thermal management capabilities making it ideal for space constrained applications.
At Electronic Products Inc. (EPI) we draw upon over six decades of experience to provide both off the shelf and customized TO-18 packages that adhere to JEDEC standards. Our expertise encompasses top notch materials such as ASTM F15 Alloy (Kovar) for matched seals and ASTM F30 (Alloy 52), for compression seals.
We also provide ceramic based designs tailored for optoelectronic and sensor uses guaranteeing effectiveness and dependability. At EPI, we provides a range of customization options for TO-18 packages, including various lead configurations, plating materials like nickel, copper, silver, and gold, and different pin lengths.
TO-18 hermetic header with 3+1 configuration
FAQs
What materials are used in the construction of the TO-18 package?
The TO-18 package is primarily constructed from metals such as ASTM-F15 Alloy (Kovar) for matched seals and ASTM-F30 (Alloy 52) for compression seals, ensuring excellent thermal and mechanical properties.
How does the hermetic sealing process work for TO-18 packages?
Hermetic sealing for TO-18 packages typically involves welding or crimping to attach the metal cap to the header, creating an airtight seal that protects the internal components from environmental factors.
What plating options are available for the TO-18 package?
EPI offers various plating options for the TO-18 package, including nickel (Ni), copper (Cu), silver (Ag), gold (Au), and combinations of these materials to enhance performance and corrosion resistance.
Can the TO-18 package be used in optoelectronic applications?
Yes, the TO-18 package can be used in optoelectronic applications. EPI provides ceramic-based designs and other customizations to meet the specific needs of optoelectronic devices.
What are the typical applications of the TO-18 package?
The TO-18 package is commonly used in high-reliability applications, including sensor technology, communication devices, medical instruments, and military equipment, where durability and performance are essential.