TO-36 Package

The TO-36 package, a known member of the ‘metal can’ package family is designed to house semiconductor devices, like transistors, diodes and integrated circuits with lead counts. Its sealed structure offers protection against environmental factors such as moisture and contaminants making it a top choice for high reliability applications. The TO-36 is highly regarded for its construction and heat dissipation capabilities making it indispensable in situations where durability and efficient thermal control are essential.

With its metal body the TO-36 package has a diameter compared to smaller options like the TO-18. Inside the metal can lies a die pad where the microchip is positioned. The package is sealed using a metal cap secured through welding or crimping methods ensuring a dependable airtight seal that safeguards internal components while maintaining optimal thermal efficiency.

At Electronic Products Inc. (EPI), we draw on over 60 years of experience to offer both standard and custom-engineered TO packages that meet JEDEC-compliant standards. We also provide tailor made solutions for uses, such, as applications that need ceramic based designs to improve performance and dependability.

EPI offers a variety of customization options for TO-36 packages, including different lead configurations, plating materials such as nickel, copper, silver, and gold, and various pin lengths. As an ISO 9001:2015 certified US manufacturer, we ensure that all our TO-36 packages are RoHS and REACH compliant, adhering to global environmental and safety standards.