TO-52 Package
Product Categories
-
RF & Microwave Packages..
-
Optical / Optoelectronic Packages..
-
Power Discrete Packages..
-
TO Packages: Headers, Caps, Lids, and More..
The TO-52 package, a known member of the ‘metal can’ (or ‘metal header’) package family is specifically designed to house semiconductor devices, like transistors and integrated circuits with a TO high number of leads. It is highly regarded for its build and ability to seal hermetically providing protection against elements such as moisture and contaminants. The TO-52 package finds use in applications where reliability and effective thermal management’s crucial.
Characterized by its metal body with a diameter and more prominent cap compared to smaller packages like the TO-18 the TO-52 offers improved thermal dissipation and structural strength. The microchip sits on the die pad inside the metal can with the package sealed using welding or crimping methods to ensure an airtight seal that preserves internal component integrity while effectively managing heat.
EPI offers customization options for TO-52 packages, including lead configurations, plating materials such as nickel, copper, silver and gold as well, as varying pin lengths. As an ISO 9001; 2015 certified manufacturer based in the US we guarantee that all our TO-52 packages comply with RoHS and REACH standards meeting environmental and safety requirements.
FAQs
What are the dimensions of the TO-52 package?
The TO-52 package typically has a base diameter of 6.0 mm and a height of approximately 4.0 mm. These dimensions may vary based on specific customizations and design requirements.
How does the hermetic sealing process work for TO-52 packages?
Hermetic sealing for TO-52 packages is achieved through welding or crimping the metal cap to the package body, creating a reliable airtight seal that protects internal components from environmental factors.
How does the TO-52 package compare to other similar packages like TO-39 or TO-46 in terms of size and performance?
The TO-52 package is more compact compared to the TO-39, offering similar thermal and mechanical protection in a smaller form factor. Compared to the TO-46, the TO-52 may provide better thermal dissipation depending on the specific application and customization, making it a preferred choice for space-constrained designs requiring efficient heat management.
How does the TO-52 package handle power dissipation?
The TO-52 package is designed to efficiently dissipate heat, with its metal body acting as a heat sink. This capability is vital for maintaining the performance and longevity of the semiconductor devices it houses, especially in high-power applications.
What are the typical applications of the TO-52 package?
The TO-52 package is commonly used in high-reliability applications including communication devices, industrial controls, medical instruments, and aerospace components, where durability and thermal management are essential.