TO-66 Package
The TO-66 package is a sturdy metal container designed to accommodate semiconductor devices, specifically transistors and power amplifiers, with power capacities. Renowned for its build and efficient heat dispersion the TO-66 package is commonly utilized in scenarios where dependable performance and effective thermal control are crucial. Its structure allows for installation and connectivity in electronic setups making it a preferred option in settings that demand high reliability.
With a rectangular metal body housing two leads and a larger metal tab for heat dissipation the TO-66 package can be attached to a heatsink or directly onto a circuit board to enhance its thermal management capabilities. The microchip is securely placed inside the metal body, which is then hermetically sealed using welding methods to safeguard against elements such as moisture and dust.
At Electronic Products Inc. (EPI) drawing on over six decades of experience we provide both customized TO packages that adhere to JEDEC standards. Our TO-66 packages are manufactured from top notch materials like ASTM F15 Alloy (Kovar) for matched seals and ASTM F30 (Alloy 52), for compression seals ensuring mechanical properties.
As an ISO 9001:2015 certified US manufacturer, we ensure that all our TO-66 packages are RoHS and REACH compliant, adhering to global environmental and safety standards.
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TO-66 - Hermetic Packages - Right Side View
TO-66 - Hermetic Packages - Left Side View
TO-66 - Hermetic Packages - Side View
TO-66 - Hermetic Packages - Bottom Side View
FAQs
What are the dimensions of the TO-66 package?
The TO-66 package typically has a length of 19.5 mm, a width of 13.8 mm, and a height of 7.7 mm. However, these dimensions may vary based on specific customizations and design requirements.
What are the common types of transistors housed in the TO-66 package?
The TO-66 package typically houses bipolar junction transistors (BJTs) and field-effect transistors (FETs) designed for medium-power applications. These transistors are used in circuits where moderate power handling and efficient heat dissipation are required.
How does the TO-66 package compare with the TO-3 package in terms of performance?
The TO-66 package is smaller and more compact than the TO-3 package, making it suitable for applications where space is limited. While the TO-66 may handle less power than the TO-3, it still provides excellent thermal management for medium-power applications. The choice between the two often depends on the specific power and space requirements of the application.
Can the TO-66 package be used in high-frequency applications?
Yes, the TO-66 package can be used in high-frequency applications, but its performance depends on the specific transistor it houses. The package design minimizes parasitic inductance and capacitance, making it suitable for RF and other high-frequency circuits, though it is more commonly used in audio and power regulation circuits.